|A technical assessment of the use of alternative FRs in various applications by comparison with traditional FR systems is examined. Five FR/product applications combinations are selected:
Printed circuit boards
Injection moulded products
To identify and assess the reliability risks with selected alternative flame retardants for use in printed circuit boards a physic-of-failure approach is followed. Since manufacturing processes and field conditions may contribute to the degradation of the FRs, the impact of the processes and conditions are included in the evaluations. Evaluations that likely are performed include:
Hygroscopicity of laminates with various FRs (selected in WP2).
Impact on surface insulation resistance.
Impact on the risk for formation of CAF.
Impact on the risk for delamination in laminates.
Impact on the integrity of via hole platings.
Impact on the peel adhesion of copper foils.